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Causes and solutions of poor wettability of PCBA solder
Source: | Author: | Add time: 2019-03-14 | | Share to:
PCBA solder wetting

The main causes of poor solder wetting are:

1. The temperature curve of the reflow furnace is not set properly and does not match the characteristics of the solder.

2. The solder paste does not match the tin spray on the PCB surface.

3. The furnace temperature set by the reflow furnace cannot reach the melting point of lead-free tin.

4, the furnace chain is too dirty, causing pad pollution.

The methods to solve the poor solder wetting are:

1. The furnace temperature curve needs to be adjusted within the standard range before production to confirm the first inspection.

2. Use lead-free solder paste to match the tin spray on the PCB surface.

3. Adjust the peak temperature of the reflow furnace to the melting point of lead-free tin.

Standard furnace method, use reflow soldering top rail to suspend furnace.